Traditional semiconductor scaling methods are no longer sufficient to meet the demands of hyperscale AI workloads.
At the TSMC OIP Ecosystem Forum, Greg Dix will discuss Broadcom’s approach to custom XPU platforms at scale, including advanced node adoption, heterogeneous multi-die integration, and near-memory architectural co-design.
Join his keynote on September 23: “Architecting the AI Future: Solving Today’s XPU Challenges with Tomorrow’s Solutions.”