A systems foundry for the AI era. Need help or have a support question? Visit Intel Support: ms.spr.ly/6054tmaop
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America's semiconductor future is being built right here at home.
Follow @BusinessInsider as they take you inside Intel Oregon—the heart of Intel's R&D network—to see how Intel Foundry is helping advance America's chipmaking leadership through innovation, investment, and manufacturing: ms.spr.ly/6013vexDL
#IntelFoundry #Manufacturing
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From FIVR to PowerVia, Intel Foundry has continued to advance power delivery for increasingly demanding compute.
Explore our new white paper on the evolution of power delivery and what’s ahead. ms.spr.ly/6012a9ql6
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Intel Foundry and @Cadence are advancing ASIC development on Intel 18A with a validated design environment designed to improve implementation and predictability for secure, mission-critical applications.
Read more: ms.spr.ly/6014a5dvC
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Intel Foundry is a Gold Sponsor of #IMAPS2026, September 28–October 1 in Boston.
Explore EMIB, Foveros, and flexible ASAT capabilities designed to help enable new system-level solutions.
Visit us at Booth #331. ms.spr.ly/6019a5RyU
#IntelFoundry
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Energy efficiency is a key part of building more sustainable semiconductor manufacturing.
Intel has cumulatively conserved 2.7B kWh since 2020 through energy efficiency investments, advancing toward our goal of 4B kWh in energy savings by 2030.
Learn more: ms.spr.ly/6016aZoxg
#IntelFoundry #Sustainability
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What’s next for advanced packaging? Hear from Lalitha Immaneni, VP of Semiconductor Research and Development at Intel, at SEMICON West 2026.
Oct. 13 from 10:00-10:25 a.m.
Register: ms.spr.ly/6012aZoYE
#IntelFoundry
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AI and HPC workloads are driving new demands on data center silicon. In Part 1 of our power delivery series, explore how innovations across process technology, power architecture, decoupling and advanced packaging are helping address these challenges. ms.spr.ly/6013abaRt
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From 6-inch masks and reticle stitching to 6x12-inch masks, Intel Foundry and @ASMLcompany are advancing High NA EUV for production and its next phase of scaling. ms.spr.ly/6011aZowX
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#ICYMI: Hear from Intel Foundry’s Chris Auth on what’s next for transistor scaling, from gate-all-around transistors and backside power delivery to new approaches to system integration for the AI era. Watch the replay. ms.spr.ly/6019akpu7
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One million+ wafers processed with High NA EUV marks a major milestone for Intel Foundry and @ASMLcompany. Together, we’re helping customers put High NA to work today with 6-inch masks, while enabling future scaling by supporting the transition to 6x12-inch masks.
Learn more: intel.com/content/www/us/en/…
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The AI era is yours for the making.
From leading-edge process and advanced packaging to semiconductor and systems IP, Intel Foundry provides the technology foundations to bring customer innovations to life. ms.spr.ly/6015aXqtv
#IntelFoundry
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AI is changing the rules of compute. Explore how advanced packaging, heterogeneous integration, and ecosystem-wide collaboration are becoming essential to unlocking the next era of AI performance: ms.spr.ly/6019aXQ4F
#IntelFoundry
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Get a closer look at the capabilities shaping the U.S. semiconductor ecosystem, from process technology and manufacturing to advanced packaging and systems integration.
Hundreds of billions are being invested in U.S. semiconductor manufacturing. But spending isn’t the same as capability.
VP and Principal Analyst @MattKimball_MIS examines how much of the full AI chip lifecycle actually operates on U.S. soil today.
📌 Read the full insight:
moorinsightsstrategy.com/bey…
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What’s next for Intel 18A? Get up to speed on Intel 18A-P in one minute and see how this enhanced process node technology builds on Intel 18A for more performance and power-efficient computing. ms.spr.ly/6012aRyIA
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Intel Foundry and @Siemens are streamlining reliability verification for advanced-node designs.
Using Siemens Calibre, the collaboration achieved a 21% reduction in verification runtimes on Intel 18A test chips, with optimizations delivering up to 36% reductions: ms.spr.ly/6019aT9xL
#IntelFoundry
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Power delivery is becoming a critical limiter to AI and HPC performance scaling.
Explore the latest white paper on the challenges shaping power delivery and the comprehensive technologies helping enable next-generation AI infrastructure.
Read more: ms.spr.ly/6018aRyjj
#IntelFoundry
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As AI and HPC workloads continue to scale, advanced packaging is key to delivering more performance in compact designs. Intel Foundry’s Foveros Direct 3D with copper hybrid bonding enables 3D interconnections to help unlock greater performance and efficiency.
Learn more: ms.spr.ly/6016aOGFr
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At Intel Foundry, we’re focused on advancing process technology in ways that translate to real-world performance. In the brief below from The Futurum Group, explore how Intel 18A-P combines RibbonFET and PowerVia to help chip designers improve operating frequency at low voltage.
AI-scale workloads are putting greater pressure on data center CPUs to deliver more performance within fixed power limits. That makes transistor architecture and power delivery key factors in determining how effectively process improvements translate into real processor performance.
In partnership with @intel, @TheFuturumGroup examines how Intel’s 18A-P process combines RibbonFET transistors with PowerVia backside power delivery to improve operating frequency at low voltage. The brief explores the silicon-validated results behind these technologies and what they mean for Diamond Rapids, Intel’s next-generation Xeon platform.
⏯️ Explore the key findings, and use the link to download the full brief:
👉 bit.ly/4xjx4GC
#Semiconductors #DataCenter #Intel #AIInfrastructure #Futurum
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Intel 18A-P expands on the Intel 18A foundation with new RibbonFET device options, including Power Boost technology plus other enhancements to deliver meaningful gains in performance and power efficiency.
Explore the latest: ms.spr.ly/6012aPHxo
#IntelFoundry
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At #HotChips2026, Intel is showcasing three upcoming architectures spanning the rack to the edge, including two processors powered by Intel Foundry technologies such as Intel 18A, Intel 18A-P, Foveros Direct 3D packaging, and more. ms.spr.ly/6019aOePU
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Every breakthrough starts with integration.
Intel Foundry brings together silicon design, leading-edge process technology, and advanced packaging to help enable what's next.
Yours for the making. ms.spr.ly/6011aJGDF
#IntelFoundry
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